Going Green

With RoHS Compliance rapidly approaching, EDL is gearing up to meet customer demands. The addition of another SMT assembly line to meet growing demand and "Green" requirements puts EDL on track to meet the July 2006 deadline.

Edl is currently evaluating lead-free solders and PCB substrates in advance of customer needs. We will be ready to assemble ahead of the deadline with updates processes and equipment.

We are working with existing customers to "clean" their bill-of-materials. If you are not exempt, now is the time to start the process. Let EDL help you with your assembly requirements. Lead-free is not enough to make your product compliant. There are many elements that are restricted.

To meet production reuirements, placement accuracies must be improved, solder paste stencils must be retooled, and the solder process (both Reflow, wave and hand solder) must be modified.

Using KIC 2000, EDL can profile the solder profile (both Reflow and wave) and "tune" the process using built-in solder optimization software.

EMAD Module

Under the Rapid Execution and Combat Targeting (REACT) Service Life Extension Program (SLEP) for the Minute III weapon system, EDL provided turnkey assembly and testing of the Embedded Memory Array Dynamic (EMAD) module. The EMAD module upgraded memory providing additional reserve for program changes.

Phoenix X-ray - Pcba Inspector

The Phoenix X-Ray PCBA Inspector is a high resolution microfocus X-Ray system dedicated to the inspection of printed circuit board assemblies. 

This system is now in operation on site. Its production control includes: standard SMT and THP/THT solder joints; area array packages such as BGA, CSP, and Flip-Chip; short circuits and missing solder connections; variations in shape and diameter of solder joints; voids; solder wetting; and inspection of multi-layer PCB's.